（深圳）IC/半導(dǎo)體/LED封裝檢測(cè)解決方案
WB&DB焊線AOI檢測(cè)設(shè)備
型號(hào)：F241/F251

主要特征 ：
1.可選的5面和6面檢查
2.2.5D深度技術(shù)
3.模塊化且靈活
4.64位操作系統(tǒng)
5.至強(qiáng)處理器
6.吞吐量從20,000上升到50,000上升
7.相機(jī)分辨率范圍從75 fps時(shí)的5百萬(wàn)像素到66fps時(shí)的12百萬(wàn)像素

應(yīng)用范圍：
1.晶圓切割后進(jìn)行檢查以檢測(cè)表面缺陷。
2.封裝分離后進(jìn)行檢查，以檢測(cè)封裝，標(biāo)記，引線和電鍍?nèi)毕荨?br />
TTVISION自動(dòng)光學(xué)檢測(cè)設(shè)備的檢測(cè)方式
*2D
*2.5D
*True 3D (Z5D)

F251
Wirebond AOI Machine

Features
3D Profiling Technology
Inspects Wrebond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Boll. Wedge. Stitch and Loop Parameters
Minimum Overki & UnderWI
Modular end Scalable Design
Cost Effective
high Throughput

F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts

2D AOI技術(shù)規(guī)格
·Onload /Offload
Number of Magazines 2-7 units
Substrate Size 30(W) x 150(L) - 200(W) x 300(L)mm
Handling
Camera Indexing High Speed Servo driven XY Gantry
Substrate Indexing Mi cro-Step Step per d riven Conveyor
·Inspection Hardware
Camera Resolution 12MP Color
Lighting Multi Channel LED
Optics Low Distortion Macro Lens
Controller PC-based
·Software
Inspection Software TTVISION ?
·Operating System MS Windows 64 bit OS
·Reject Handling
Electronic Mapping
Defect Classification 99 Categories

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